Prof. Tung-Han Chuang's Research Team Awarded the Best Conference Presentation in 2019 Industry-Academy Collaborative Research Projects
Group photo of Prof. Tung-Han Chuang (left 1) and his research team.
Distinguished Professor Tung-Han Chuang (莊東漢) of Material Science and his research team collaborate with WIRE TECHNOLOGY CO., LTD. (樂金公司) and successfully develop the Ag-alloy Bonding Wire for High Power Module Package, which is awarded the best presentation in 2019 Industry-Academy Collaborative Research Projects held by Department of Engineering and Technologies (MOST).
NTU research team and WIRE TECHNOLOGY CO., LTD. are the pioneers of Ag-alloy Bonding Wire and promote this new invention to the semiconductor industry market. This package technology gets the patent “Alloy Wire and Methods for Manufacturing The Same” from six countries including Taiwan TW I 384082, Korea 10-1328863, America Patent No: US 8,940,403 B2, Japan JP/5670412, China CN/ZL 1670992, and Germany DE 10 201300057 B4. In addition, this new invention is presented in 16 SCI papers, awarded 2013 National Invention and Creation Awards & 2013 National Industrial Innovation Award from ROC Ministry of Economic Affairs, and selected in 2015 R&D100 Awards.
This successful research result has been the mainstream in IC and LED packaging market. So far WIRE TECHNOLOGY CO., LTD. has provided ag-alloy bonding wires over 300,000 kilometers every year, with sales of about NTD 150 million. Many major IC and LED packaging factories in China and Southeast Asia are also the clients of WIRE TECHNOLOGY CO., LTD.