Asian Engineering Deans' Summit, AEDS 2025

2025/6/9

The 12th Asian Engineering Deans’ Summit (AEDS 2025) was co-hosted by the College of Engineering and the College of Electrical Engineering and Computer Science at National Taiwan University (NTU). This year’s summit brought together over 60 participants, including more than 20 deans and senior academic leaders from top engineering institutions across 7 countries and regions, alongside esteemed representatives from 12 Taiwanese universities and organizations. Over two days of in-depth academic exchange, distinguished scholars, policymakers, and research leaders convened to explore the evolving landscape of engineering education, innovation ecosystems, and international collaboration.

Since its inaugural event at the National University of Singapore in 2010, AEDS has served as a vital platform for engineering deans across Asia to engage in meaningful dialogue and strategic cooperation. The summit has since been hosted by leading institutions across the region, including the Chinese University of Hong Kong (2012), Yonsei University (2013), Peking University (2014), National University of Singapore (2015), Zhejiang University (2016), University of New South Wales (2017), Tokyo Institute of Technology (2018), National Taiwan University (2019), University of Hong Kong (2023), and the Indian Institute of Science, Bengaluru (2024). AEDS was paused from 2020 to 2022 due to the COVID-19 pandemic.

In response to the accelerating pace of global change and technological advancement, the theme of AEDS 2025 was “Reinventing Engineering for the Future.” This theme reflects the collective mission of participating institutions to reshape engineering through cutting-edge research, transformative education, and robust academic–industry partnerships. The summit agenda focused on four key areas central to this transformation:

　1.Front-end Research: breakthrough discoveries and interdisciplinary innovations driving future engineering;
　2.Education: integrative teaching practices, soft skills development, and lifelong learning promotion;
　3.Applied Research & Industry Linkage: successful university–industry collaboration models and commercialization pathways;
  4.AI & Semiconductor: transformative roles of artificial intelligence and semiconductor technology in engineering, with an emphasis on scalability and sustainability.

Together, these themes framed a summit filled with inspiring discussions, shared visions, and new collaborative prospects for the next era of global engineering education.